The Underfill market size will be XX million (USD) in 2022 in United States, from the XX million (USD) in 2016, with a CAGR (Compound Annual Growth Rate) XX% from 2016 to 2022.
In United States market, the top players include
- Henkel
- WON CHEMICAL
- NAMICS
- SUNSTAR
- Hitachi Chemical
- Fuji
- Shin-Etsu Chemical
- Bondline
- AIM Solder
- Zymet
- Panacol-Elosol
- Master Bond
- DOVER
- Darbond
- HIGHTITE
This report with sales, revenue and market share for each type, split by product types/category, covering
- Semiconductor Underfills
- Board Level Underfills
This report focuses on sales, market share and growth rate of Underfill in each application, split by applications/end use industries, covers
- Industrial Electronics
- Defense & Aerospace Electronics
- Consumer Electronics (laptops, mobile phones, MP3 players, game consoles, digital cameras,etc.)
- Automotive Electronics
- Medical Electronics
- Others