2018-2023 Global 3D Semiconductor Packaging Consumption Market Report

  • ID:PD030069
  • August 2018
  • LPI (LP Information)
                          

In this report, LP Information covers the present scenario (with the base year being 2017) and the growth prospects of global 3D Semiconductor Packaging market for 2018-2023.

3D semiconductor packaging refers to an advanced packaging technology of semiconductor chips in which two or more layers of active electronic components are stacked together and interconnected vertically as well as horizontally to perform as a single device. This technology possesses various advantages over other advanced packaging technologies such as reduced space consumption, decreased power loss, better overall performance, and enhanced efficiency which makes 3D semiconductor packaging industry the leading amongst all advanced packaging technologies.

Global 3D semiconductor packaging market size is estimated to reach $8.9 billion by 2022, growing at a CAGR of 15.7 % from 2016 to 2022. 

Over the next five years, LPI(LP Information) projects that 3D Semiconductor Packaging will register a xx% CAGR in terms of revenue, reach US$ xx million by 2023, from US$ xx million in 2017.

This report presents a comprehensive overview, market shares, and growth opportunities of 3D Semiconductor Packaging market by product type, application, key manufacturers and key regions.

To calculate the market size, LP Information considers value and volume generated from the sales of the following segments:

Segmentation by product type:

  •     3D Wire Bonded
  •     3D Through Silicon Via
  •     3D Package on Package
  •     3D Fan Out Based

Segmentation by application:
  •     Consumer Electronics
  •     Others

This report also splits the market by region:
    Americas
  •         United States
  •         Canada
  •         Mexico
  •         Brazil
    APAC
  •         China
  •         Japan
  •         Korea
  •         Southeast Asia
  •         India
  •         Australia
    Europe
  •         Germany
  •         France
  •         UK
  •         Italy
  •         Russia
  •         Spain
    Middle East & Africa
  •         Egypt
  •         South Africa
  •         Israel
  •         Turkey
  •         GCC Countries

The report also presents the market competition landscape and a corresponding detailed analysis of the major vendor/manufacturers in the market. The key manufacturers covered in this report:
  •     Amkor Technology
  •     ASE Group
  •     Siliconware Precision Industries
  •     Jiangsu Changjiang Electronics Technology
  •     SÜSS MicroTec
  •     International Business Machines Corporation (IBM)
  •     Intel Corporation
  •     Qualcomm Technologies
  •     STMicroelectronics
  •     Taiwan Semiconductor Manufacturing Company
  •     Son
  •     SAMSUNG Electronics
  •     Advanced Micro Devices
  •     Cisco

In addition, this report discusses the key drivers influencing market growth, opportunities, the challenges and the risks faced by key manufacturers and the market as a whole. It also analyzes key emerging trends and their impact on present and future development.

Research objectives
  •     To study and analyze the global 3D Semiconductor Packaging consumption (value & volume) by key regions/countries, product type and application, history data from 2013 to 2017, and forecast to 2023.
  •     To understand the structure of 3D Semiconductor Packaging market by identifying its various subsegments.
  •     Focuses on the key global 3D Semiconductor Packaging manufacturers, to define, describe and analyze the sales volume, value, market share, market competition landscape, SWOT analysis and development plans in next few years.
  •     To analyze the 3D Semiconductor Packaging with respect to individual growth trends, future prospects, and their contribution to the total market.
  •     To share detailed information about the key factors influencing the growth of the market (growth potential, opportunities, drivers, industry-specific challenges and risks).
  •     To project the consumption of 3D Semiconductor Packaging submarkets, with respect to key regions (along with their respective key countries).
  •     To analyze competitive developments such as expansions, agreements, new product launches, and acquisitions in the market.
  •     To strategically profile the key players and comprehensively analyze their growth strategies.

1 Scope of the Report
1.1 Market Introduction
1.2 Research Objectives
1.3 Years Considered
1.4 Market Research Methodology
1.5 Economic Indicators
1.6 Currency Considered
 
2 Executive Summary
2.1 World Market Overview
2.1.1 Global 3D Semiconductor Packaging Consumption 2013-2023
2.1.2 3D Semiconductor Packaging Consumption CAGR by Region
2.2 3D Semiconductor Packaging Segment by Type
2.2.1 3D Wire Bonded
2.2.2 3D Through Silicon Via
2.2.3 3D Package on Package
2.2.4 3D Fan Out Based
2.3 3D Semiconductor Packaging Consumption by Type
2.3.1 Global 3D Semiconductor Packaging Consumption Market Share by Type (2013-2018)
2.3.2 Global 3D Semiconductor Packaging Revenue and Market Share by Type (2013-2018)
2.3.3 Global 3D Semiconductor Packaging Sale Price by Type (2013-2018)
2.4 3D Semiconductor Packaging Segment by Application
2.4.1 Consumer Electronics
2.4.2 Others
2.5 3D Semiconductor Packaging Consumption by Application
2.5.1 Global 3D Semiconductor Packaging Consumption Market Share by Application (2013-2018)
2.5.2 Global 3D Semiconductor Packaging Value and Market Share by Application (2013-2018)
2.5.3 Global 3D Semiconductor Packaging Sale Price by Application (2013-2018)
 
3 Global 3D Semiconductor Packaging by Players
3.1 Global 3D Semiconductor Packaging Sales Market Share by Players
3.1.1 Global 3D Semiconductor Packaging Sales by Players (2016-2018)
3.1.2 Global 3D Semiconductor Packaging Sales Market Share by Players (2016-2018)
3.2 Global 3D Semiconductor Packaging Revenue Market Share by Players
3.2.1 Global 3D Semiconductor Packaging Revenue by Players (2016-2018)
3.2.2 Global 3D Semiconductor Packaging Revenue Market Share by Players (2016-2018)
3.3 Global 3D Semiconductor Packaging Sale Price by Players
3.4 Global 3D Semiconductor Packaging Manufacturing Base Distribution, Sales Area, Product Types by Players
3.4.1 Global 3D Semiconductor Packaging Manufacturing Base Distribution and Sales Area by Players
3.4.2 Players 3D Semiconductor Packaging Products Offered
3.5 Market Concentration Rate Analysis
3.5.1 Competition Landscape Analysis
3.5.2 Concentration Ratio (CR3, CR5 and CR10) (2016-2018)
3.6 New Products and Potential Entrants
3.7 Mergers & Acquisitions, Expansion
 
4 3D Semiconductor Packaging by Regions
4.1 3D Semiconductor Packaging by Regions
4.1.1 Global 3D Semiconductor Packaging Consumption by Regions
4.1.2 Global 3D Semiconductor Packaging Value by Regions
4.2 Americas 3D Semiconductor Packaging Consumption Growth
4.3 APAC 3D Semiconductor Packaging Consumption Growth
4.4 Europe 3D Semiconductor Packaging Consumption Growth
4.5 Middle East & Africa 3D Semiconductor Packaging Consumption Growth
 
5 Americas
5.1 Americas 3D Semiconductor Packaging Consumption by Countries
5.1.1 Americas 3D Semiconductor Packaging Consumption by Countries (2013-2018)
5.1.2 Americas 3D Semiconductor Packaging Value by Countries (2013-2018)
5.2 Americas 3D Semiconductor Packaging Consumption by Type
5.3 Americas 3D Semiconductor Packaging Consumption by Application
5.4 United States
5.5 Canada
5.6 Mexico
5.7 Key Economic Indicators of Few Americas Countries
 
6 APAC
6.1 APAC 3D Semiconductor Packaging Consumption by Countries
6.1.1 APAC 3D Semiconductor Packaging Consumption by Countries (2013-2018)
6.1.2 APAC 3D Semiconductor Packaging Value by Countries (2013-2018)
6.2 APAC 3D Semiconductor Packaging Consumption by Type
6.3 APAC 3D Semiconductor Packaging Consumption by Application
6.4 China
6.5 Japan
6.6 Korea
6.7 Southeast Asia
6.8 India
6.9 Australia
6.10 Key Economic Indicators of Few APAC Countries
 
7 Europe
7.1 Europe 3D Semiconductor Packaging by Countries
7.1.1 Europe 3D Semiconductor Packaging Consumption by Countries (2013-2018)
7.1.2 Europe 3D Semiconductor Packaging Value by Countries (2013-2018)
7.2 Europe 3D Semiconductor Packaging Consumption by Type
7.3 Europe 3D Semiconductor Packaging Consumption by Application
7.4 Germany
7.5 France
7.6 UK
7.7 Italy
7.8 Russia
7.9 Spain
7.10 Key Economic Indicators of Few Europe Countries
 
8 Middle East & Africa
8.1 Middle East & Africa 3D Semiconductor Packaging by Countries
8.1.1 Middle East & Africa 3D Semiconductor Packaging Consumption by Countries (2013-2018)
8.1.2 Middle East & Africa 3D Semiconductor Packaging Value by Countries (2013-2018)
8.2 Middle East & Africa 3D Semiconductor Packaging Consumption by Type
8.3 Middle East & Africa 3D Semiconductor Packaging Consumption by Application
8.4 Egypt
8.5 South Africa
8.6 Israel
8.7 Turkey
8.8 GCC Countries
 
9 Market Drivers, Challenges and Trends
9.1 Market Drivers and Impact
9.1.1 Growing Demand from Key Regions
9.1.2 Growing Demand from Key Applications and Potential Industries
9.2 Market Challenges and Impact
9.3 Market Trends
 
10 Marketing, Distributors and Customer
10.1 Sales Channel
10.1.1 Direct Marketing
10.1.2 Indirect Marketing
10.2 3D Semiconductor Packaging Distributors
10.3 3D Semiconductor Packaging Customer
 
11 Global 3D Semiconductor Packaging Market Forecast
11.1 Global 3D Semiconductor Packaging Consumption Forecast (2018-2023)
11.2 Global 3D Semiconductor Packaging Forecast by Regions
11.2.1 Global 3D Semiconductor Packaging Forecast by Regions (2018-2023)
11.2.2 Global 3D Semiconductor Packaging Value Forecast by Regions (2018-2023)
11.2.3 Americas Consumption Forecast
11.2.4 APAC Consumption Forecast
11.2.5 Europe Consumption Forecast
11.2.6 Middle East & Africa Consumption Forecast
11.3 Americas Forecast by Countries
11.3.1 United States Market Forecast
11.3.2 Canada Market Forecast
11.3.3 Mexico Market Forecast
11.3.4 Brazil Market Forecast
11.4 APAC Forecast by Countries
11.4.1 China Market Forecast
11.4.2 Japan Market Forecast
11.4.3 Korea Market Forecast
11.4.4 Southeast Asia Market Forecast
11.4.5 India Market Forecast
11.4.6 Australia Market Forecast
11.5 Europe Forecast by Countries
11.5.1 Germany Market Forecast
11.5.2 France Market Forecast
11.5.3 UK Market Forecast
11.5.4 Italy Market Forecast
11.5.5 Russia Market Forecast
11.5.6 Spain Market Forecast
11.6 Middle East & Africa Forecast by Countries
11.6.1 Egypt Market Forecast
11.6.2 South Africa Market Forecast
11.6.3 Israel Market Forecast
11.6.4 Turkey Market Forecast
11.6.5 GCC Countries Market Forecast
11.7 Global 3D Semiconductor Packaging Forecast by Type
11.8 Global 3D Semiconductor Packaging Forecast by Application
 
12 Key Players Analysis
12.1 Amkor Technology
12.1.1 Company Details
12.1.2 3D Semiconductor Packaging Product Offered
12.1.3 Amkor Technology 3D Semiconductor Packaging Sales, Revenue, Price and Gross Margin (2016-2018)
12.1.4 Main Business Overview
12.1.5 Amkor Technology News
12.2 ASE Group
12.2.1 Company Details
12.2.2 3D Semiconductor Packaging Product Offered
12.2.3 ASE Group 3D Semiconductor Packaging Sales, Revenue, Price and Gross Margin (2016-2018)
12.2.4 Main Business Overview
12.2.5 ASE Group News
12.3 Siliconware Precision Industries
12.3.1 Company Details
12.3.2 3D Semiconductor Packaging Product Offered
12.3.3 Siliconware Precision Industries 3D Semiconductor Packaging Sales, Revenue, Price and Gross Margin (2016-2018)
12.3.4 Main Business Overview
12.3.5 Siliconware Precision Industries News
12.4 Jiangsu Changjiang Electronics Technology
12.4.1 Company Details
12.4.2 3D Semiconductor Packaging Product Offered
12.4.3 Jiangsu Changjiang Electronics Technology 3D Semiconductor Packaging Sales, Revenue, Price and Gross Margin (2016-2018)
12.4.4 Main Business Overview
12.4.5 Jiangsu Changjiang Electronics Technology News
12.5 SÜSS MicroTec
12.5.1 Company Details
12.5.2 3D Semiconductor Packaging Product Offered
12.5.3 SÜSS MicroTec 3D Semiconductor Packaging Sales, Revenue, Price and Gross Margin (2016-2018)
12.5.4 Main Business Overview
12.5.5 SÜSS MicroTec News
12.6 International Business Machines Corporation (IBM)
12.6.1 Company Details
12.6.2 3D Semiconductor Packaging Product Offered
12.6.3 International Business Machines Corporation (IBM) 3D Semiconductor Packaging Sales, Revenue, Price and Gross Margin (2016-2018)
12.6.4 Main Business Overview
12.6.5 International Business Machines Corporation (IBM) News
12.7 Intel Corporation
12.7.1 Company Details
12.7.2 3D Semiconductor Packaging Product Offered
12.7.3 Intel Corporation 3D Semiconductor Packaging Sales, Revenue, Price and Gross Margin (2016-2018)
12.7.4 Main Business Overview
12.7.5 Intel Corporation News
12.8 Qualcomm Technologies
12.8.1 Company Details
12.8.2 3D Semiconductor Packaging Product Offered
12.8.3 Qualcomm Technologies 3D Semiconductor Packaging Sales, Revenue, Price and Gross Margin (2016-2018)
12.8.4 Main Business Overview
12.8.5 Qualcomm Technologies News
12.9 STMicroelectronics
12.9.1 Company Details
12.9.2 3D Semiconductor Packaging Product Offered
12.9.3 STMicroelectronics 3D Semiconductor Packaging Sales, Revenue, Price and Gross Margin (2016-2018)
12.9.4 Main Business Overview
12.9.5 STMicroelectronics News
12.10 Taiwan Semiconductor Manufacturing Company
12.10.1 Company Details
12.10.2 3D Semiconductor Packaging Product Offered
12.10.3 Taiwan Semiconductor Manufacturing Company 3D Semiconductor Packaging Sales, Revenue, Price and Gross Margin (2016-2018)
12.10.4 Main Business Overview
12.10.5 Taiwan Semiconductor Manufacturing Company News
12.11 Son
12.12 SAMSUNG Electronics
12.13 Advanced Micro Devices
12.14 Cisco
 
13 Research Findings and Conclusion

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