Global IC Packaging Market Insights, Forecast to 2025

  • ID:PD001318
  • August 2019
  • QY Research
                          

IC Packaging Market Research Report offered by DecisionDatabases.com provides a detailed study on the industrial development of the market under the forecast period 2019-2025. The Global IC Packaging Industry Report gives an elaborate information about the market size, share and analyzes the complete value chain the report also covers the market dynamics enriching business strategists with quality data about the IC Packaging market.
 
This study also analyzes the market status, market share, growth rate, future trends, market drivers, opportunities and challenges, risks and entry barriers, sales channels, distributors and Porter's Five Forces Analysis.
 
IC packaging (a.k.a. IC assembly) is one of the essential processes and technologies in IC manufacture, connecting the bare die to the PCB. In electronics manufacturing, integrated circuit packaging is the final stage of semiconductor device fabrication, in which the tiny block of semiconducting material is encased in a supporting case that prevents physical damage and corrosion.
 
This industry is affected by the economy and policy, so it’s important to put an eye to economic indexes and leaders’ prefer. With the global economic recovery, more and more people pay attention to rising environment standards, especially in underdevelopment regions that have a large population and fast economic growth, the need will increase.
 
The industry is a high-technology and high-profit industry, the research team maintain a very optimistic attitude. It is suggested that the new enterprises to enter the field.
 
We tend to believe this industry now is close to mature, and the consumption increasing degree will show a smooth curve. On product prices, the slow downward trend in recent years will maintain in the future, as competition intensifies, prices gap between different brands will go narrowing. Similarly, there will be fluctuation in gross margin.
 
The IC Packaging market was valued at xx Million US$ in 2017 and is projected to reach xx Million US$ by 2025, at a CAGR of xx% during the forecast period. In this study, 2017 has been considered as the base year and 2018 to 2025 as the forecast period to estimate the market size for IC Packaging.
 
The following manufacturers are covered in this report:

  • ASE
  • Amkor
  • SPIL
  • STATS ChipPac
  • Powertech Technology
  • J-devices
  • UTAC
  • JECT
  • ChipMOS
  • Chipbond
 
IC Packaging Breakdown Data by Type
  • DIP
  • SOP
  • QFP
  • QFN
  • BGA
  • CSP
  • LGA
  • WLP
  • FC
  • Others
 
IC Packaging Breakdown Data by Application
  • CIS
  • MEMS
  • Others
 
IC Packaging Production by Region
  • United States
  • Europe
  • China
  • Japan
  • South Korea
  • Other Regions
 
IC Packaging Consumption by Region
  • North America
  • United States
  • Canada
  • Mexico
  • Asia-Pacific
  • China
  • India
  • Japan
  • South Korea
  • Australia
  • Indonesia
  • Malaysia
  • Philippines
  • Thailand
  • Vietnam
  • Europe
  • Germany
  • France
  • UK
  • Italy
  • Russia
  • Rest of Europe
  • Central & South America
  • Brazil
  • Rest of South America
  • Middle East & Africa
  • GCC Countries
  • Turkey
  • Egypt
  • South Africa
  • Rest of Middle East & Africa
 
  • The study objectives are:
  • To analyze and research the global IC Packaging status and future forecast´╝îinvolving, production, revenue, consumption, historical and forecast.
  • To present the key IC Packaging manufacturers, production, revenue, market share, and recent development.
  • To split the breakdown data by regions, type, manufacturers and applications.
  • To analyze the global and key regions market potential and advantage, opportunity and challenge, restraints and risks.
  • To identify significant trends, drivers, influence factors in global and regions.
  • To analyze competitive developments such as expansions, agreements, new product launches, and acquisitions in the market.

Table of Contents - Guidelines
1 Study Coverage
1.1 IC Packaging Product
1.2 Key Market Segments in This Study
1.3 Key Manufacturers Covered
1.4 Market by Type
1.4.1 Global IC Packaging Market Size Growth Rate by Type
1.4.2 DIP
1.4.3 SOP
1.4.4 QFP
1.4.5 QFN
1.4.6 BGA
1.4.7 CSP
1.4.8 LGA
1.4.9 WLP
1.4.10 FC
1.4.11 Others
1.5 Market by Application
1.5.1 Global IC Packaging Market Size Growth Rate by Application
1.5.2 CIS
1.5.3 MEMS
1.5.4 Others
1.6 Study Objectives
1.7 Years Considered
2 Executive Summary
2.1 Global IC Packaging Market Size
2.1.1 Global IC Packaging Revenue 2013-2025
2.1.2 Global IC Packaging Production 2013-2025
2.2 IC Packaging Growth Rate (CAGR) 2018-2025
2.3 Analysis of Competitive Landscape
2.3.1 Manufacturers Market Concentration Ratio (CR5 and HHI)
2.3.2 Key IC Packaging Manufacturers
2.3.2.1 IC Packaging Manufacturing Base Distribution, Headquarters
2.3.2.2 Manufacturers IC Packaging Product Offered
2.3.2.3 Date of Manufacturers Enter into IC Packaging Market
2.4 Key Trends for IC Packaging Markets & Products
3 Market Size by Manufacturers
3.1 IC Packaging Production by Manufacturers
3.1.1 IC Packaging Production by Manufacturers
3.1.2 IC Packaging Production Market Share by Manufacturers
3.2 IC Packaging Revenue by Manufacturers
3.2.1 IC Packaging Revenue by Manufacturers (2013-2018)
3.2.2 IC Packaging Revenue Share by Manufacturers (2013-2018)
3.3 IC Packaging Price by Manufacturers
3.4 Mergers & Acquisitions, Expansion Plans
4 IC Packaging Production by Regions
4.1 Global IC Packaging Production by Regions
4.1.1 Global IC Packaging Production Market Share by Regions
4.1.2 Global IC Packaging Revenue Market Share by Regions
4.2 United States
4.2.1 United States IC Packaging Production
4.2.2 United States IC Packaging Revenue
4.2.3 Key Players in United States
4.2.4 United States IC Packaging Import & Export
4.3 Europe
4.3.1 Europe IC Packaging Production
4.3.2 Europe IC Packaging Revenue
4.3.3 Key Players in Europe
4.3.4 Europe IC Packaging Import & Export
4.4 China
4.4.1 China IC Packaging Production
4.4.2 China IC Packaging Revenue
4.4.3 Key Players in China
4.4.4 China IC Packaging Import & Export
4.5 Japan
4.5.1 Japan IC Packaging Production
4.5.2 Japan IC Packaging Revenue
4.5.3 Key Players in Japan
4.5.4 Japan IC Packaging Import & Export
4.6 South Korea
4.6.1 South Korea IC Packaging Production
4.6.2 South Korea IC Packaging Revenue
4.6.3 Key Players in South Korea
4.6.4 South Korea IC Packaging Import & Export
4.7 Other Regions
4.7.1 Taiwan
4.7.2 India
4.7.3 Southeast Asia
5 IC Packaging Consumption by Regions
5.1 Global IC Packaging Consumption by Regions
5.1.1 Global IC Packaging Consumption by Regions
5.1.2 Global IC Packaging Consumption Market Share by Regions
5.2 North America
5.2.1 North America IC Packaging Consumption by Application
5.2.2 North America IC Packaging Consumption by Countries
5.2.3 United States
5.2.4 Canada
5.2.5 Mexico
5.3 Europe
5.3.1 Europe IC Packaging Consumption by Application
5.3.2 Europe IC Packaging Consumption by Countries
5.3.3 Germany
5.3.4 France
5.3.5 UK
5.3.6 Italy
5.3.7 Russia
5.4 Asia Pacific
5.4.1 Asia Pacific IC Packaging Consumption by Application
5.4.2 Asia Pacific IC Packaging Consumption by Countries
5.4.3 China
5.4.4 Japan
5.4.5 South Korea
5.4.6 India
5.4.7 Australia
5.4.8 Indonesia
5.4.9 Thailand
5.4.10 Malaysia
5.4.11 Philippines
5.4.12 Vietnam
5.5 Central & South America
5.5.1 Central & South America IC Packaging Consumption by Application
5.5.2 Central & South America IC Packaging Consumption by Country
5.5.3 Brazil
5.6 Middle East and Africa
5.6.1 Middle East and Africa IC Packaging Consumption by Application
5.6.2 Middle East and Africa IC Packaging Consumption by Countries
5.6.3 GCC Countries
5.6.4 Egypt
5.6.5 South Africa
6 Market Size by Type
6.1 Global IC Packaging Production by Type
6.2 Global IC Packaging Revenue by Type
6.3 IC Packaging Price by Type
7 Market Size by Application
7.1 Overview
7.2 Global IC Packaging Breakdown Dada by Application
7.2.1 Global IC Packaging Consumption by Application
7.2.2 Global IC Packaging Consumption Market Share by Application (2013-2018)
8 Manufacturers Profiles
8.1 ASE
8.1.1 ASE Company Details
8.1.2 Company Overview
8.1.3 ASE IC Packaging Production Revenue and Gross Margin (2013-2018)
8.1.4 ASE IC Packaging Product Description
8.1.5 ASE Recent Development
8.2 Amkor
8.2.1 Amkor Company Details
8.2.2 Company Overview
8.2.3 Amkor IC Packaging Production Revenue and Gross Margin (2013-2018)
8.2.4 Amkor IC Packaging Product Description
8.2.5 Amkor Recent Development
8.3 SPIL
8.3.1 SPIL Company Details
8.3.2 Company Overview
8.3.3 SPIL IC Packaging Production Revenue and Gross Margin (2013-2018)
8.3.4 SPIL IC Packaging Product Description
8.3.5 SPIL Recent Development
8.4 STATS ChipPac
8.4.1 STATS ChipPac Company Details
8.4.2 Company Overview
8.4.3 STATS ChipPac IC Packaging Production Revenue and Gross Margin (2013-2018)
8.4.4 STATS ChipPac IC Packaging Product Description
8.4.5 STATS ChipPac Recent Development
8.5 Powertech Technology
8.5.1 Powertech Technology Company Details
8.5.2 Company Overview
8.5.3 Powertech Technology IC Packaging Production Revenue and Gross Margin (2013-2018)
8.5.4 Powertech Technology IC Packaging Product Description
8.5.5 Powertech Technology Recent Development
8.6 J-devices
8.6.1 J-devices Company Details
8.6.2 Company Overview
8.6.3 J-devices IC Packaging Production Revenue and Gross Margin (2013-2018)
8.6.4 J-devices IC Packaging Product Description
8.6.5 J-devices Recent Development
8.7 UTAC
8.7.1 UTAC Company Details
8.7.2 Company Overview
8.7.3 UTAC IC Packaging Production Revenue and Gross Margin (2013-2018)
8.7.4 UTAC IC Packaging Product Description
8.7.5 UTAC Recent Development
8.8 JECT
8.8.1 JECT Company Details
8.8.2 Company Overview
8.8.3 JECT IC Packaging Production Revenue and Gross Margin (2013-2018)
8.8.4 JECT IC Packaging Product Description
8.8.5 JECT Recent Development
8.9 ChipMOS
8.9.1 ChipMOS Company Details
8.9.2 Company Overview
8.9.3 ChipMOS IC Packaging Production Revenue and Gross Margin (2013-2018)
8.9.4 ChipMOS IC Packaging Product Description
8.9.5 ChipMOS Recent Development
8.10 Chipbond
8.10.1 Chipbond Company Details
8.10.2 Company Overview
8.10.3 Chipbond IC Packaging Production Revenue and Gross Margin (2013-2018)
8.10.4 Chipbond IC Packaging Product Description
8.10.5 Chipbond Recent Development
9 Production Forecasts
9.1 IC Packaging Production and Revenue Forecast
9.1.1 Global IC Packaging Production Forecast 2018-2025
9.1.2 Global IC Packaging Revenue Forecast 2018-2025
9.2 IC Packaging Production and Revenue Forecast by Regions
9.2.1 Global IC Packaging Revenue Forecast by Regions
9.2.2 Global IC Packaging Production Forecast by Regions
9.3 IC Packaging Key Producers Forecast
9.3.1 United States
9.3.2 Europe
9.3.3 China
9.3.4 Japan
9.3.5 South Korea
9.4 Forecast by Type
9.4.1 Global IC Packaging Production Forecast by Type
9.4.2 Global IC Packaging Revenue Forecast by Type
10 Consumption Forecast
10.1 IC Packaging Consumption Forecast by Application
10.2 IC Packaging Consumption Forecast by Regions
10.3 North America Market Consumption Forecast
10.3.1 North America IC Packaging Consumption Forecast by Regions 2018-2025
10.3.2 United States
10.3.3 Canada
10.3.4 Mexico
10.4 Europe Market Consumption Forecast
10.4.1 Europe IC Packaging Consumption Forecast by Regions 2018-2025
10.4.2 Germany
10.4.3 France
10.4.4 UK
10.4.5 Italy
10.4.6 Russia
10.5 Asia Pacific Market Consumption Forecast
10.5.1 Asia Pacific IC Packaging Consumption Forecast by Regions 2018-2025
10.5.2 China
10.5.3 Japan
10.5.4 South Korea
10.5.5 India
10.5.6 Australia
10.5.7 Indonesia
10.5.8 Thailand
10.5.9 Malaysia
10.5.10 Philippines
10.5.11 Vietnam
10.6 Central & South America Market Consumption Forecast
10.6.1 Central & South America IC Packaging Consumption Forecast by Regions 2018-2025
10.6.2 Brazil
10.7 Middle East and Africa Market Consumption Forecast
10.7.1 Middle East and Africa IC Packaging Consumption Forecast by Regions 2018-2025
10.7.2 GCC Countries
10.7.3 Egypt
10.7.4 South Africa
11 Value Chain and Sales Channels Analysis
11.1 Value Chain Analysis
11.2 Sales Channels Analysis
11.2.1 IC Packaging Sales Channels
11.2.2 IC Packaging Distributors
11.3 IC Packaging Customers
12 Market Opportunities & Challenges, Risks and Influences Factors Analysis
12.1 Market Opportunities and Drivers
12.2 Market Challenges
12.3 Market Risks/Restraints
12.4 Key World Economic Indicators
13 Key Findings in the Global IC Packaging Study
14 Appendix

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