The Global Wafer Level Packaging Market report segments the market by type (3D TSV WLP, 2.5D TSV WLP, WLCSP, Nano WLP, Others ( 2D TSV WLP and Compliant WLP)) and by application (Electronics, IT & Telecommunication, Industrial, Automotive, Aerospace & Defense, Healthcare, Others (Media & Entertainment and Non-Conventional Energy Resources)). This report covers the key market players such as Amkor Technology Inc, Fujitsu Ltd, Jiangsu Changjiang Electronics, Deca Technologies, Qualcomm Inc, Toshiba Corp, Tokyo Electron Ltd, Applied Materials, Inc, ASML Holding NV, Lam Research Corp, KLA-Tencor Corration, China Wafer Level CSP Co. Ltd, Marvell Technology Group Ltd, Siliconware Precision Industries, Nanium SA, STATS Chip, PAC Ltd.
The Wafer Level Packaging industry report is a complete market study which ensures availability of insightful data and strategic information. Market statistics such as global Wafer Level Packaging market size, estimated and forecasted data for next 6 years with breakdown at regional and country level is covered in the report. The market segmentation by type and application along with manufacturers profile and share gives a clear understanding of the market dynamics. The analysis on sales along with the study of latest developments in the past years - covering product launches, mergers and technological innovation is covered in the report.
The report on Wafer Level Packaging market explores the upcoming opportunities in the industry, thus assisting in strategic decision making by the reader. The report covers volume and/or revenue (as applicable) data and the CAGR of the market calculated considering multiple quantitative and qualitative analytical tools.
Market segment by Type, covers
- 3D TSV WLP
- 2.5D TSV WLP
- WLCSP
- Nano WLP
- Others ( 2D TSV WLP and Compliant WLP)
Market segment by Application can be divided into
- Electronics
- IT & Telecommunication
- Industrial
- Automotive
- Aerospace & Defense
- Healthcare
- Others (Media & Entertainment and Non-Conventional Energy Resources)
The key market players for global Wafer Level Packaging market are listed below:
- Amkor Technology Inc
- Fujitsu Ltd
- Jiangsu Changjiang Electronics
- Deca Technologies
- Qualcomm Inc
- Toshiba Corp
- Tokyo Electron Ltd
- Applied Materials, Inc
- ASML Holding NV
- Lam Research Corp
- KLA-Tencor Corration
- China Wafer Level CSP Co. Ltd
- Marvell Technology Group Ltd
- Siliconware Precision Industries
- Nanium SA
- STATS Chip
- PAC Ltd
The standard report covers the below regions and countries -
- North America Region Covering - (United States, Canada and Mexico)
- Europe Region Covering - (Germany, France, United Kingdom, Russia, Italy, and Rest of Europe)
- Asia-Pacific Region Covering - (China, Japan, Korea, India, Southeast Asia, and Australia)
- South America Region Covering - (Brazil, Argentina, Colombia, and Rest of South America)
- Middle East & Africa Region Covering - (Saudi Arabia, UAE, Egypt, South Africa, and Rest of Middle East & Africa).
We also provide customized report covering specific countries/companies or segments on request.