The Die Bonder Equipment market size will be XX million (USD) in 2022 in China, from the XX million (USD) in 2016, with a CAGR (Compound Annual Growth Rate) XX% from 2016 to 2022.
In China market, the top players include
- Besi
- ASM Pacific Technology (ASMPT)
- Kulicke & Soffa
- Palomar Technologies
- Shinkawa
- DIAS Automation
- Toray Engineering
- Panasonic
- FASFORD TECHNOLOGY
- West-Bond
- Hybond
This report with sales, revenue and market share for each type, split by product types/category, covering
- Fully Automatic
- Semi-Automatic
- Manual
This report focuses on sales, market share and growth rate of Die Bonder Equipment in each application, split by applications/end use industries, covers
- Integrated Device Manufacturers (IDMs)
- Outsourced Semiconductor Assembly and Test (OSAT)